Description
| Item | HPHE/SSPS-SH-2034 |
| Silica（SiO2）% | 38-42 |
| proportion（20℃，g/cm³) | 1.265-1.3 |
| PH（20℃） | 10.0-12.5 |
| Viscosity（20℃，mm²/s） | ≤5 |
| The average particle size（nm） | 120-140 |
| Modified additives | Have |
| Stable period (months) | 6 |
Product appearance:
milky white.
Product application:
Suitable for polishing silicon, gallium arsenide and other semiconductor materials, with high purity and fast removal rate.
Packing:
Packed in 25L/200L/1000L polyethylene plastic barrel, transported and stored under the environment of 0～40℃.
Storage:
Avoid contact with eyes and skin during use. If you accidentally touch it, rinse it off with running water.
| Item | HPHE/SSPS-SH-2034 |
| Silica（SiO2）% | 38-42 |
| proportion（20℃，g/cm³) | 1.265-1.3 |
| PH（20℃） | 10.0-12.5 |
| Viscosity（20℃，mm²/s） | ≤5 |
| The average particle size（nm） | 120-140 |
| Modified additives | Have |
| Stable period (months) | 6 |
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